PCBA Assessment Services

PCBA Assessment Services

DfA (Design for Assembly)

Is the design targeted to maximize the PCBA layout which will result low cost, fit to the latest design rules of the industries such as IPC standard as an example?

DfM (Design for Manufacturability)

Does the design include the PCB/PCBA manufacturing aspects to ensure best FPY (First Pass Yield), CoNq(Cost of Non-Quality) and reliability performance?

DfT (Design for Testability)

Does the PCBA has the best test coverage strategy to catch bad components via ICT (In-circuit-Test) when benchmark against World-Class test strategy?

Technology Migration

How any components on the PCBA that are old technology parts, more than 15 years old, and they are going to be EOL soon by the suppliers and what is migration path available?

Cost, Quality and AOS (Assurance of Supply) Control

How easy the PCBA can utilize modularization technology to safe guard these three areas to maintain ongoing production requirement?

DfM Example:
DfM (Design for Manufacturability)

IPC recommends over 50% vertical solder fill for Class 2 products, but acknowledges that in certain applications, less than 100% solder fill might be unacceptable due to factors like thermal shock or electrical performance.

Recommendation:
Choose a different pin style such as kinked option

DfA Example:
DfA (Design for Assembly)

The copper to copper spacing (pad to track same net) is less than required min value 0.100mm.

Recommendation:
Increase the clearance to min 0.100mm

DfT Example:
Feature In-Circuit Test (ICT) Flying Probe Test (FPT) Functional Test (FCT)
Fixture Required Yes No Yes (custom)
Test Speed Very fast Moderate Slow
Suitable for Volume High Low to Medium All
Coverage Type Structural Structural Functional
Setup Cost High Low Medium to High
Ideal Use Case Mass production Prototypes, low volume Final product validation

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